Intel Xeon Silver 4316 processor 2.3 GHz 30 MB Tray
1,617.76 CAD
Intel Xeon Silver 4316 processor 2.3 GHz 30 MB Tray
1,617.76 CAD
Intel Xeon Silver 4316 processor 2.3 GHz 30 MB Tray
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| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor family | Intel Xeon Silver |
| Processor cores | 20 |
| Processor socket | LGA 4189 |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor model | 4316 |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 30 MB |
| Processor threads | 40 |
| System bus rate | 10.4 GT/s |
| Processor ARK ID | 215270 |
| Processor operating modes | 64-bit |
| Processor codename | Ice Lake |
| Processor boost frequency | 3.4 GHz |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Features | |
| Execute Disable Bit | Yes |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 150 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 215270 |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | No |
| Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 8 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 84 °C |
| Technical details | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 150 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 2 |
| Memory speed (max) | 2667 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Packaging data | |
| Package type | Tray |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |